Asher Stripper/Descum - Matrix 105

peterchen@***
***
****************************************
Matrix 105 provides high throughput in a single wafer system capable of handling wide variety of substrates, including round, square and ranging from 3” up to 6”. By maintaining independent closed-loop system controls, the system optimizes vital device parameters.
Combined with Allwin21 Corp advanced Robot control technology , Superior Temperature Control Technologyand AW Control Software, upgraded Matrix 105 provides significant advantages over the original systems:
Single Wafer, Multi-Step Processing
Closed-Loop Temperature Control
Pressure Control
Accurate, closed-loop pressure control with “butterfly-style” throttle valve and capacitance manometer
RF power: 100 to 500 watts
Timed cycles up to 4 hour each
New hardware includes: New control Board with cable, new timer counter with watch dog, Pentium Computer with 17” LCD Monitor, standard keyboard and mouse.
Software calibration and easy to be done.
More functions and I/O hardware “exposed” for easier maintenance and trouble shooting.
It is easy to edit recipe with GUI and graph display.
Save all process data on the computer hard disk.
A/D and D/A precision is 14 to 16 bits.
Detect in process and with color curve displayed on the screen.
Robot teach is on the GUI and easy to do the procedure with new concept teaching method.
Software watch dog to eliminate machine damage duo to the computer locks up or freeze.
Sensor status detect function.
On line help function

Upgraded Matrix105 Applications
Photoresist Stripping
High dose implant (As+, B+, P+)
 Post-polysilicon etch
Post-metal etch
Post-oxide etch
 Rework
Controlled Resist Removal
Post-develop descum (pre-etch)
 Dry/wet process capability
Resist planarization
Uniformity capability )(5% 1
GaAs wafer Stripping and Descum
Thin Film Head Resist Cleaning and Surface Treatment
MEMS (Micro Electro- Mechanical Systems) Up to 4 hour processes
The Upgraded Matrix 105 consists of the following major assemblies:
Main Console:
Process Model,
Operator interface Model,
Wafer Transport Module,
Elevator Module,
PC Control Module.
Power Supply Console:
RF Generator,
DC Supply,
AC Distribution,
Gas Distribution panel,
Temperature/Pressure Control Module.
Vacuum Pump (optional):
Vacuum Hose and Connector, Ballast Assembly.

****************************************
The AW Control Software provides a unique upgrade for RTP, Stripper, Etching and other systems which have won a high reputation among our customers.

The AW software Integrates all of the Process Control into a single reliable software package. It allows the user to control the entire machine from one single interface. The user can create recipes, run processes with the recipes, view and analyze process parameters, calibrate the entire system, and run diagnostics routines.
Features:
• GUI interface
• Real-Time process data acquisition
• Real-Time graphics
• Process Data Analysis
• Process Data and Recipe storage on a hard drive.
• Recipe Editor for Multi-step Processing
• System Calibration and Diagnostics
• Closed-loop System Controls

It has a Graphics User Interface (GUI) instead of the old Text based user interface. It is intuitive and easy to use with mouse or touch screen (optional).

The AW software Acquires Process Data in real-time. It then plots it in real-time on a graphics X-Y plot. So, what you see is what is actually happening. The process data is stored on a hard disk in real-time. This data can latter be retrieved and analyzed.

The blue line is the actual temperature. The black line is the recipe curve. The red line is the power changing for the heating source.

The AW software contains a Recipe Editor for creating and editing of multi-step process recipes. Recipes are created to automate the process of semiconductor wafers by telling the process control how to control each available parameter. It also allows the fine-tuning of certain parameters for specific applications.

It has comprehensive System Calibration and Diagnostics routines to automate many tasks and to help troubleshoot the system.

By maintaining real-time independent Closed-loop System Controls, the system optimizes vital device parameters

The AW Software upgrade uses a Pentium class computer, eliminating the old 80386 CPU, 6800 MPU, or the Z-80 MPU.
******************************************
Superior Temperature Control Technology
The software incorporates a Superior Temperature Control Technology that surpasses all original manufactures specs. The AW software is capable of controlling the temperature of the wafer to ± 1°C. It is also able to control the temperature from wafer-to-wafer to ± 0.5°C. This is possible with the built-in automated calibration routines and the upgraded 16 bit D/A card. First, the A/D circuits for the temperature feedback devices are calibrated. Then the pyrometer (optional on some systems) is calibrated. In order for the software to understand the thermal capacitance of the system, the chamber is also calibrated. These calibration routines allow the software to understand the complete system, taking into consideration the subtleties of the A/D circuits and the thermal capacitance of heating and cooling of the process chamber.
******************************************
Plasma Asher Stripper Descum
In semiconductor manufacturing plasma asher/stripper is the process of removing the photoresist from an etched wafer. Using a plasma source, a monatomic reactive species is generated. Oxygen or fluorine are the most common reactive species. The reactive species combines with the photoresist to form ashing which is removed with a vacuum pump.
Typically, monatomic (single atom) oxygen plasma is created by exposing oxygen gas (O2) to ionizing radiation. At the same time, many free radicals are formed which could damage the wafer. Newer, smaller circuitry is increasingly susceptible to these particles. Originally, plasma was generated in the process chamber, but as the need to get rid of free radicals has increased, many machines now use a downstream plasma configuration, where plasma is formed remotely and channeled to the wafer. This allows electrically charged particles time to recombine before they reach the wafer surface, and prevents damage to the wafer surface.
Monatomic oxygen is electrically neutral and although it does recombine during the channeling, it does so at a slower rate than the positively or negatively charged free radicals, which attract one another. Effectively, this means that when all of the free radicals have recombined, there is still a portion of the active species available for process. Because a large portion of the active specie is lost to recombination, process times may take longer. To some extent, these longer process times can be mitigated by increasing the temperature of the reaction area.
Allwin21 Corp focuses on the following main Asher Stripper Descum equipments.
Matrix 105
Matrix 205
Gasonics Aura 1000
Gasonics Aura 2000
Gasonics Aura 3010
Tegal 901e
 Tegal 903e
Branson IPC 3000

These systems can be used as descum which can increase the yield of optical lithography.
AW Control Software provides the unique upgrade system for Matrix, Gasonics Aura, Tegal, Branson IPC Series. Advantage of upgraded system include:
Integrated process control system
Real time graphics display
Real time process data acquisition, display, and analysis
Programmed comprehensive calibration and diagnostic functions
Better performance and maintenance than the original systems
*****************************************
We focus on the following tools.
Rapid Thermal Process/Annealing.
(1)Upgraded AG 210 (2)Upgraded AG 410 (3)Upgraded AG 610(AccuThermo AW 610).
(4)Upgraded AG 4100 (5)Upgraded AG 4100S (6)Upgraded AG 4108 (7)Upgraded AG 8108
(8)Upgraded AG 8800
Plasma Etch/Asher/Descum.
(1)Upgraded Matrix 105 (2)Upgraded Matrix 205 (3)Upgraded Matrix 303 (4)Upgraded
Matrix 403
(5)Upgraded Tegal 901 (6)Upgraded Tegal 903 (7)Upgraded Tegal 901e(8)Upgraded Tegal 903e
(9)Upgraded Gasonics AE 2001 (10)Upgraded Gasonics Aura 1000 (11)Upgraded Gasonics Aura 3010
(12)Upgraded Gasonics PEP 3510 (13)Upgraded Branson IPC 3000
PECVD/RIE/ICP.
(1)STS 310 (2)STS 320 (3)Plasma Thermal 700 720 (4)Plasma Thermal 790
Probe/Tester.
(1)EG 1034 (2)EG 2001 (3)EG 2010 (4)HP 4062 (5)HP 4145B (6)HP 4142B (7)HP 4155
(8)HP 4084B (9)HP 4085B
***
peterchen@***