YIXING FENGHUA ELECTRONIC APPARATUS MFG CO.(svloadcell@) is one of the Chinese designer and manufacturer of load cell ( skope type load cell ,bridge type load cell, column type load cell,s type load cell,shear beam type load cell,paralle beam type load ce

YIXING FENGHUA ELECTRONIC APPARATUS MFG CO.(svloadcell@) is one of the Chinese designer and manufacturer of load cell ( skope type load cell ,bridge type load cell, column type load cell,s type load cell,shear beam type load cell,paralle beam type load ce

YIXING FENGHUA ELECTRONIC APPARATUS MFG CO.(svloadcell@) is one of the Chinese designer and manufacturer of load cell ( skope type load cell ,bridge type load cell, column type load cell,s type load cell,shear beam type load cell,paralle beam type load ce

1). Strip size 580*17mm2). Aluminum base, 1.0mm, 1oz3). Single sided layer4). White solder mask/Black legend5). HASL 6). LED high power

1). FR-4 Tg 170 + Rogers 4350B2). 290*130mm/1up3). 6 layers at 1.6mm thick4). Green solder mask/White ident5). 35um copper finished, ED copper.6). Electroless gold.7). Countersunk slots.

1). 100*85mm, FR-4 Tg170/ Polyimide2). 4 layer count rigid/2 layer flex3). 1.0mm thick rigid/0.15mm thick flex4). 1 oz each layer5). Green LPI solder mask/white ident6). Immersion gold

1). Laser cut stencil2). 12" x 12" to 28" x 28", aluminum framed3). Stainless steel shim4). PCB locate in the middle of the squeegee area5). Engraving and electro polishing6). Good use for CSP, BGA, Fine QFP package

1). 100mm x 98mm/1up, FR-4, 2). 1mm +/-0.1mm，6 Layers3). 1oz copper finished3). Green solder mask/white legend4). Min. hole 0.15mm, 4/4 mil track/gap5). Blind via layer 1-2, via-in-pad.6). Immersion gold surface finish

1). 177 x 75mm (2UP), FR-4 Tg 1702). 1.6mm +/-10%, 6 layer3). Min. hole 0.15mm, 4/4 track/gap4). Finished copper weight inner/outer 1 oz5). Green solder mask/ White ident6). Immerstion gold.7). Fine pitch and micro BGA

1). 80 *190mm/2up, FR-42). 6 layers at 1.4mm thick3). 35 μm copper weight4). Green solder mask LPI/White legend5). ENIG surface finish6). Blind via from Layer 1 to layer 27). Via in pad plugged conductive resin