Spare Parts - Spare Parts

Spare Parts for Semiconductor Equipments from Allwin21 Corp
-peterchen@***
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Spare Parts
Allwin21 provides a complete inventory of spare parts for several product lines including AG RTP machine, Gasnoics, Matrix,T egal, STS, EG, HP etc. Our vast network of preferred spare parts suppliers will ensure
our customers fast, cost-effective spare parts solutions.

If you have spare parts for sale or can't find what you are looking for in our database, please contact us at sales@***

We focus on supplying the spare parts of the following.
Category---Rapid Thermal Process
AG 210 Spare Parts
AG 410 Spare Parts
AG 610 Spare Parts
AG 4100 Spare Parts
AG 4100S Spare Parts
AG 4108 Spare Parts
AG 8108 Spare Parts
AG 8800 Spare Parts

Category---Plasma Asher/Stripper/Descum
Matrix 101 Spare Parts
Matrix 102 Spare Parts
Matrix 103 Spare Parts
Matrix 105 Spare Parts
Matrix 205 Spare Parts
Gasonics Aura 1000 Spare Parts
Gasonics Aura 3010 Spare Parts

Category---Plasma Etching
Tegal 901 Spare Parts
Tegal 903 Spare Parts
Tegal 901e Spare Parts
Tegal 903e Spare Parts
Matrix 303 Spare Parts
Matrix 403 Spare Parts

Category---Probe
EG 1034 Spare Parts
EG 2001 Spare Parts
EG 2010 Spare Parts

Category---Tester
HP 4062 Spare Parts
HP 4142B Spare Parts
HP 4145B Spare Parts

Category---General
AG Control Boards
Aera Mass Flow Controllers
Brooks Mass Flow Controllers
Millipore Mass Flow Controllers
STEC Mass Flow Controllers
Tylan Mass Flow Controllers
Unit Mass Flow Controllers
Vacuum Spare Parts
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AW Control Software
The AW Control Software provides a unique upgrade for RTP, Stripper, Etching and other systems which have won a high reputation among our customers.

The AW software Integrates all of the Process Control into a single reliable software package. It allows the user to control the entire machine from one single interface. The user can create recipes, run processes with the recipes, view and analyze process parameters, calibrate the entire system, and run diagnostics routines.

Features:
• GUI interface
• Real-Time process data acquisition
• Real-Time graphics
• Process Data Analysis
• Process Data and Recipe storage on a hard drive.
• Recipe Editor for Multi-step Processing
• System Calibration and Diagnostics
• Closed-loop System Controls

It has a Graphics User Interface (GUI) instead of the old Text based user interface. It is intuitive and easy to use with mouse or touch screen (optional).

The AW software Acquires Process Data in real-time. It then plots it in real-time on a graphics X-Y plot. So, what you see is what is actually happening. The process data is stored on a hard disk in real-time. This data can latter be retrieved and analyzed.

The blue line is the actual temperature. The black line is the recipe curve. The red line is the power changing for the heating source.

The AW software contains a Recipe Editor for creating and editing of multi-step process recipes. Recipes are created to automate the process of semiconductor wafers by telling the process control how to control each available parameter. It also allows the fine-tuning of certain parameters for specific applications.

It has comprehensive System Calibration and Diagnostics routines to automate many tasks and to help troubleshoot the system.
By maintaining real-time independent Closed-loop System Controls, the system optimizes vital device parameters

The AW Software upgrade uses a Pentium class computer, eliminating the old 80386 CPU, 6800 MPU, or the Z-80 MPU.
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Superior Temperature Control Technology
The software incorporates a Superior Temperature Control Technology that surpasses all original manufactures specs. The AW software is capable of controlling the temperature of the wafer to ± 1°C. It is also able to control the temperature from wafer-to-wafer to ± 0.5°C. This is possible with the built-in automated calibration routines and the upgraded 16 bit D/A card. First, the A/D circuits for the temperature feedback devices are calibrated. Then the pyrometer (optional on some systems) is calibrated. In order for the software to understand the thermal capacitance of the system, the chamber is also calibrated. These calibration routines allow the software to understand the complete system, taking into consideration the subtleties of the A/D circuits and the thermal capacitance of heating and cooling of the process chamber.

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Plasma Etch

Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module, and every wafer undergoes many etching steps before it is complete.
If the etch is intended to make a cavity in a material, the depth of the cavity may be controlled approximately using the etching time and the known etch rate. More often, though, etching must entirely remove the top layer of a multilayer structure, without damaging the underlying or masking layers. The etching system's ability to do this depends on the ratio of etch rates in the two materials (selectivity).
Some etches undercut the masking layer and form cavities with sloping sidewalls. The distance of undercutting is called bias. Etchants with large bias are called isotropic.
Modern VLSI processes avoid wet etching, and use plasma etching instead. Plasma systems can operate in several modes by adjusting the parameters of the plasma. Ordinary plasma etching operates between 0.1 and 5 Torr. (This unit of pressure, commonly used in vacuum engineering, equals approximately 133.3 pascals) The plasma produces energetic free radicals, neutrally charged, that react at the surface of the wafer. Since neutral particles attack the wafer from all angles, this process is isotropic.
The source gas for the plasma usually contains small molecules rich in chlorine or fluorine. For instance, carbon tetrachloride (CCl4) etches silicon and aluminium, and trifluoromethane etches silicon dioxide and silicon nitride. A plasma containing oxygen is used to oxidize ("ash") photoresist and facilitate its removal.

Allwin21 Corp focuses on the following main Etcher equipments.
Matrix303
Matrix403
Gasonics AE2001
Gasonics PEP3510
Spare Parts for Semiconductor Equipments from Allwin21 Corp
-peterchen@***
***
*****************************
Spare Parts
Allwin21 provides a complete inventory of spare parts for several product lines including AG RTP machine, Gasnoics, Matrix,T egal, STS, EG, HP etc. Our vast network of preferred spare parts suppliers will ensure our customers fast, cost-effective spare parts solutions.

If you have spare parts for sale or can't find what you are looking for in our database, please contact us at sales@***

We focus on supplying the spare parts of the following.
Category---Rapid Thermal Process
AG 210 Spare Parts
AG 410 Spare Parts
AG 610 Spare Parts
AG 4100 Spare Parts
AG 4100S Spare Parts
AG 4108 Spare Parts
AG 8108 Spare Parts
AG 8800 Spare Parts

Category---Plasma Asher/Stripper/Descum
Matrix 101 Spare Parts
Matrix 102 Spare Parts
Matrix 103 Spare Parts
Matrix 105 Spare Parts
Matrix 205 Spare Parts
Gasonics Aura 1000 Spare Parts
Gasonics Aura 3010 Spare Parts

Category---Plasma Etching
Tegal 901 Spare Parts
Tegal 903 Spare Parts
Tegal 901e Spare Parts
Tegal 903e Spare Parts
Matrix 303 Spare Parts
Matrix 403 Spare Parts

Category---Probe
EG 1034 Spare Parts
EG 2001 Spare Parts
EG 2010 Spare Parts

Category---Tester
HP 4062 Spare Parts
HP 4142B Spare Parts
HP 4145B Spare Parts

Category---General
AG Control Boards
Aera Mass Flow Controllers
Brooks Mass Flow Controllers
Millipore Mass Flow Controllers
STEC Mass Flow Controllers
Tylan Mass Flow Controllers
Unit Mass Flow Controllers
Vacuum Spare Parts
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AW Control Software
The AW Control Software provides a unique upgrade for RTP, Stripper, Etching and other systems which have won a high reputation among our customers.

The AW software Integrates all of the Process Control into a single reliable software package. It allows the user to control the entire machine from one single interface. The user can create recipes, run processes with the recipes, view and analyze process parameters, calibrate the entire system, and run diagnostics routines.

Features:
• GUI interface
• Real-Time process data acquisition
• Real-Time graphics
• Process Data Analysis
• Process Data and Recipe storage on a hard drive.
• Recipe Editor for Multi-step Processing
• System Calibration and Diagnostics
• Closed-loop System Controls

It has a Graphics User Interface (GUI) instead of the old Text based user interface. It is intuitive and easy to use with mouse or touch screen (optional).

The AW software Acquires Process Data in real-time. It then plots it in real-time on a graphics X-Y plot. So, what you see is what is actually happening. The process data is stored on a hard disk in real-time. This data can latter be retrieved and analyzed.

The blue line is the actual temperature. The black line is the recipe curve. The red line is the power changing for the heating source.

The AW software contains a Recipe Editor for creating and editing of multi-step process recipes. Recipes are created to automate the process of semiconductor wafers by telling the process control how to control each available parameter. It also allows the fine-tuning of certain parameters for specific applications.

It has comprehensive System Calibration and Diagnostics routines to automate many tasks and to help troubleshoot the system.

By maintaining real-time independent Closed-loop System Controls, the system optimizes vital device parameters

The AW Software upgrade uses a Pentium class computer, eliminating the old 80386 CPU, 6800 MPU, or the Z-80 MPU.
*******************************************
Superior Temperature Control Technology
The software incorporates a Superior Temperature Control Technology that surpasses all original manufactures specs. The AW software is capable of controlling the temperature of the wafer to ± 1°C. It is also able to control the temperature from wafer-to-wafer to ± 0.5°C. This is possible with the built-in automated calibration routines and the upgraded 16 bit D/A card. First, the A/D circuits for the temperature feedback devices are calibrated. Then the pyrometer (optional on some systems) is calibrated. In order for the software to understand the thermal capacitance of the system, the chamber is also calibrated. These calibration routines allow the software to understand the complete system, taking into consideration the subtleties of the A/D circuits and the thermal capacitance of heating and cooling of the process chamber.

********************************************
Plasma Etch

Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module, and every wafer undergoes many etching steps before it is complete.
If the etch is intended to make a cavity in a material, the depth of the cavity may be controlled approximately using the etching time and the known etch rate. More often, though, etching must entirely remove the top layer of a multilayer structure, without damaging the underlying or masking layers. The etching system's ability to do this depends on the ratio of etch rates in the two materials (selectivity).
Some etches undercut the masking layer and form cavities with sloping sidewalls. The distance of undercutting is called bias. Etchants with large bias are called isotropic.
Modern VLSI processes avoid wet etching, and use plasma etching instead. Plasma systems can operate in several modes by adjusting the parameters of the plasma. Ordinary plasma etching operates between 0.1 and 5 Torr. (This unit of pressure, commonly used in vacuum engineering, equals approximately 133.3 pascals) The plasma produces energetic free radicals, neutrally charged, that react at the surface of the wafer. Since neutral particles attack the wafer from all angles, this process is isotropic.
The source gas for the plasma usually contains small molecules rich in chlorine or fluorine. For instance, carbon tetrachloride (CCl4) etches silicon and aluminium, and trifluoromethane etches silicon dioxide and silicon nitride. A plasma containing oxygen is used to oxidize ("ash") photoresist and facilitate its removal.

Allwin21 Corp focuses on the following main Etcher equipments.
Matrix303
Matrix403
Gasonics AE2001
 Gasonics PEP3510
Tegal901e
Tegal903e

AW Control Software provides the unique upgrade system for Matrix, Gasonics, Tegal, Series. Advantage of upgraded system include:
Integrated process control system
Real time graphics display
Real time process data acquisition, display, and analysis
Programmed comprehensive calibration and diagnostic functions
Better performance and maintenance than the original systems
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We focus on the following tools.
Rapid Thermal Process/Annealing.
(1)Upgraded AG 210 (2)Upgraded AG 410 (3)Upgraded AG 610(AccuThermo AW 610).
(4)Upgraded AG 4100 (5)Upgraded AG 4100S (6)Upgraded AG 4108 (7)Upgraded AG 8108
(8)Upgraded AG 8800
Plasma Etch/Asher/Descum.
(1)Upgraded Matrix 105 (2)Upgraded Matrix 205 (3)Upgraded Matrix 303 (4)Upgraded Matrix 403
(5)Upgraded Tegal 901 (6)Upgraded Tegal 903 (7)Upgraded Tegal 901e(8)Upgraded Tegal 903e
(9)Upgraded Gasonics AE 2001 (10)Upgraded Gasonics Aura 1000 (11)Upgraded Gasonics Aura 3010
(12)Upgraded Gasonics PEP 3510 (13)Upgraded Branson IPC 3000
PECVD/RIE/ICP.
(1)STS 310 (2)STS 320 (3)Plasma Thermal 700 720 (4)Plasma Thermal 790
Probe/Tester.
(1)EG 1034 (2)EG 2001 (3)EG 2010 (4)HP 4062 (5)HP 4145B (6)HP 4142B (7)HP 4155
(8)HP 4084B (9)HP 4085B
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peterchen@***