via in pad PCB - BIC-5451F Specificaton & Trade Terms
| Model | BIC-5451F |
|---|
| Place Of Origin | CHINA |
|---|
| Price Term | EXW |
|---|
| Payment Term | T/T |
|---|
1). 80 *190mm/2up, FR-4
2). 6 layers at 1.4mm thick
3). 35 μm copper weight
4). Green solder mask LPI/White legend
5). ENIG surface finish
6). Blind via from Layer 1 to layer 2
7). Via in pad plugged conductive resin
