Micro BGA pcb - BIC-548F Specificaton & Trade Terms
| Model | BIC-548F |
|---|
| Place Of Origin | CHINA |
|---|
| Price Term | EXW |
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| Payment Term | T/T |
|---|
1). 177 x 75mm (2UP), FR-4 Tg 170
2). 1.6mm +/-10%, 6 layer
3). Min. hole 0.15mm, 4/4 track/gap
4). Finished copper weight inner/outer 1 oz
5). Green solder mask/ White ident
6). Immerstion gold.
7). Fine pitch and micro BGA
