Polyimide film - hc

Polyimide film is Polyimide Polycondensate by polycondensing PMDA and DDE through the process of forming film in strong solvents and then being treated by imine at high temperature. Such film possesses excellent physical, chemical, and electrical properties, which performs successfully in the wide range of temperature as low as -452F(-269 ℃ ) and as high as +436F(+260 ℃ ) and can be exposed at +752F(400 ℃ ) in short time, besides, it is of atomic radiation resistant. Polyimide film is currently the macromolecular compound with the best combined properties and the highest heat resistant.
Applications
These films are widely used in space navigation products, electrical motors, transporting machines, weapons, electronic instruments, communication equipment and in the petrochemical industry.
1. wire and cable tapes , formed coil insulation , flexible printed circuit board substrates, motor slot liners , magnet wire insulation, transformer and capacitor insulation, magnetic and pressure-sensitive tapes, tubing
2. The backing material of pressure-sensitive adhesive tape, F46 (FEP) tape.
3.The substrates of Flexible Printed Circuits Board (F-PCB).
Technical requirement:
1. Appearance: film is surfacing, un-bubbly, non-pinholed and without 　any conduction admixture.
2. The Standards Thickness, Spec and Tolerance number of film.
Size:
Width: 500, 520,1000mm, or Cutting to tapes.
Thickness: 0.025mm, 0.05mm, 0.075mm, 0.100mm. Tolerance: +/-10%